Published: November 27, 2009
Author: Amber Lupala
Editor: Amber Lupala
Thermal conductivity is another way to say heat transfer, and good thermal conductivity to your heatsink means lower temps for your processor. Thermal interface material is an important part of the thermal interface between your heatsink and processor. It fills the microscopic pits and valleys that can form between two pieces of metal. Since the thermal interface material has better thermal conductivity than air, more heat can flow from the heat source (processor) to the heat dissipation device.
Today we will be looking at eight different thermal interface materials. Each of them are claimed to be the best, but which one conducts the most heat? Which one is easiest to apply and remove? Join us as we take a look at each of these pastes.
The eight different pastes that we are testing today are:
· Arctic Cooling MX-3
· Cooler Master ThermalFusion 400
· Coolink Chillaramic
· Gelid GC2
· Gelid GC Extreme
· Noctua NT-H1
· ThermalTake TG-2
· Tuniq TX-3
These eight pastes are all very high performance versions, so they should all perform very well. Not only will we be testing and reporting temperature rise with these pastes, we will also report on their consistency and ease of application.
In the following pages, each thermal paste will be listed with manufacturer provided features and write-ups. We will also include thermal conductivity numbers where the manufacturer provides them. Higher thermal conductance means the paste can transfer heat better.
Now, let’s take a look at the contenders.